Mixing Tank

Product introduction

1、 Definition and funct♠βion of polishing liquid₽≈  mixing tank

Buffing tank is a special equipment ≤↑εfor mixing, storing and disper↔εsing buffing liquid (CMP Slurry, meta↑× l slurry, etc.), whic™£✘h is widely used in <÷semiconductor, optical, metal proc©↓essing and other industries. Its core φ₹λ$functions include:

Uniform mixing: πσ;Prevent abrasive part♣∑λ✘icles in the polishing liquid (such δα↓↔as SIO2, Al₂O ₃) from←  settling or agitating.

Temperature control: maintain tλ∏he constant temperature of the po'♥♠≠lishing liquid to avoid temperatπ ure fluctuations affecting the polishi‌ >"ng effect.

Anti-contamination: Ensu★ €re that the polishing liquid is stored <≈in a clean environment to ©•prevent the introduction& ×♥ of foreign matter.

2、Equipment structure and working pr•≠♠inciple

1. Core components

Barrel Body:

Material: 316L stain∑¶♦∏less steel (corrosion resistance¥€☆σ), PP/PTFE (anti-static, acid and alkal¶÷ i resistance).

Mixing system:

Mixer type: paddle type, anchor type, s'π" crew type (selected according to visc§βδosity).

Drive motor: variable frequen"÷≈cy speed regulation (0-500 rpm), →¥™ power 0.5-15 kW.

Temperature control sy"↑stem:

Heating/cooling jacket: t​$≠γhrough the heat transfer &≤♥©oil or cooling water, t•←♠emperature control range of 5✘♥℃-80℃.

Temperature sensor: PT100 probe, accu×₹racy ±0.5℃.

Auxiliary system:

Liquid level monitoring:♦™ < ultrasonic or float type liquid leve≈'l gauge.

Cyclic filtration: on-line filter (≤≈'♠0.1-1μm accuracy) to ✘♠‍prevent agglomeration oλγ₽f particles.

2. How it works

The motor drives the agitator to rotat®®αδe, forming laminar flow orΩΩ¶ turbulence, so that the abrasi®Ωve and additives in the polis®÷•hing liquid are evenly dispersed. T¥♠δhe temperature control system re≥₹¥≈gulates the liquid temperature t¶∞hrough a jacketed medium↕©ε• to ensure chemical stability.

3、Technical parameters

Parameter Typical values/ε•Description

Capacity 50L-5000L (cu↑♣stomizable)

Mixing speed 0-500 rp≤¶¥m (stepless speed regε§≈¥ulation)

Power 0.5kW (small) -15kW∞↓ (large)

Temperature control range 5℃ -80 ℃ ↕♦(accuracy ±1℃)

Contact material 316L sta↕×inless steel, PP, PTFE, fluorine rubb ​>✔er seal ring

4、 Application sαα€&cenarios

Semiconductor Manufacturing:∏✘β

Mixing and storage o→↓≈≤f CMP polishing fluid (chemical-±φmechanical polishing) wit≠★ hout metal ion contam✔×≠ination.

Optical lens processing:

Constant temperature stirring of glass♣★× polishing liquid pr∏πα events particle settlement.

Metal surface treatme∏εnt:

Circulating mixing of el× ↕ectroplating solution and₽λ pickling solution to improve process≥™₩σ consistency.

Lithium battery materials:

Dispersion of positi∏"→≤ve/negative slurry ensures uniform co←•ating.

Product advantages

1、advanced equipment technology, exqui☆ site workmanship

2、Long normal service life, high ↓↕> pass rate, to the technical level of ‍∑σ§imported equipment, more cost-effec©✘tive.

3、our company has nearly 20 year← ©αs of experience in technical and after♠± -sales service team, frα¶om design and producti★₽on to after-sales service to proδ>vide customers with professδ✘✔ional solutions.

5、 Selection and maintenance su♥™∞ggestions

1. Key points of selection

Polishing fluid characteri"©♣stics:

High viscosity (such as lithi ×um paste) : Choose anchor or δ€spiral agitator.

Low viscosity (e.g. CMP polishes) :✘ε paddle or magnetic agitation.¥α$≈

Cleanliness requirements:

Semiconductor grade: 316L stainle☆↕αss steel + nitrogen seal + circul★•↓♦ation filtration.

Industrial grade: PP materi&δπ↑al + mechanical seal.

Capacity matching:

Select capacity according to producti∑®on line requirements (↑£¥e.g. 500L/ batch).

2. Maintenance

Daily maintenance:

Clean the inner wall £>εof the barrel weekly and checα✔k for seal wear.

Calibrate the temperat×↕ure sensor monthly and clean the ☆"filter.

Long-term maintenance:

Replace the agitator bearing oil∏× every year to test the motor insulatio‍σ‌n.

Complete inspection oφ÷₩δf the clamp pipe every 2 years to preσπ¶vent leakage.

6、Common problems and solutions

Problem cause analysis so'↔>↓lution

The particle settling stirring  ×€÷speed is insufficient or the ti✘∑£ me is too short to incr±₩ ☆ease the rotational speed a$←nd prolong the stirring time

Temperature fluctuation large jackεδet medium uneven flow check pump valve,∞§ adjust flow

Seal leakage seal ri♥‍ng aging or improper installation Rep​↔÷★lace the seal ring, recalibrate th"☆e shaft

Motor overheating load is too large or↔δφ↑ poor heat dissipation reduce the $∞€speed, clean the heat dissipation✘¥♥ fan

7、 Technology development tr" $end

Intelligent:

Integrated Internet λ of Things (IoT) to monitor vi‌₽¥≥scosity and particle distributiβ€λ✘on in real time.

AI algorithm optimizes mixing paramet♥≠ers and ADAPTS to di​αfferent recipes.

Greening:

Low energy motor desi≈ ✘gn to reduce carbon footprint.

Biodegradable materials"∑ replace traditional seals.

For more models of products, pleas'↔e contact us. We will be happy to ₽€☆serve you!