Oven

1、Definition and function

Upper and lower chamber oven is an ind©δustrial or laboratory heλ✘≤at treatment equipment th×≥at divides the heating area into an ☆↕ ↕upper chamber and a lo<•↓wer chamber. The two chambe≤​Ωσrs can be controlled by ind✔♦βependent or linkage temperatu  re to achieve phased heating, parεε♥γtition treatment or ₩← ≈simultaneous different p↑♦✔rocesses, which is suitable for scen₩‌✘es requiring hierarchical tempα★erature control or process differ≥©÷entiation, such as material pre-dryin<&™g, curing, cooling, etc.

2、Structure and design $♠®↓characteristics

Cavity layout:

Upper and lower layers ♦: The upper chamber is usually used ←π★for high temperature treatment (sucβ"'h as curing), the lo₽$™wer chamber is used for lo ÷w temperature drying or cooli→↓ng, and the middle is separate¥λd by insulation.

Independent/linkage controlλ←€: Support independent temperatΩ‍ure control (the temperature diff ↕erence between the up™✔per and lower cavities can reach morπ≥€e than 100 ° C) or linkag→δπ e program (the temperature of the upperα∞ and lower cavities changes synchronous€↓‌ly according to the set curv✘"e).

Heating and ventilat' πion system:

Independent heating module: ↔ σThe upper and lower cavities are equipp"™✔ed with heating tubes (such as stainlesβ&✘s steel or quartz tubes)∑ ™δ to ensure independent tempera±α↑γture control.

Forced convection circulaσ£♠αtion: built-in multiple fans to ensu₩÷βre the uniformity of temperature in eac‍≥h chamber (temperature diffe∞¶>rence ≤±1.5℃).

Intelligent control system:

Dual channel temperature co<↕¥ntrol: upper and lower chamber indepe ≥  ndent PID regulation, "↑↑ support programmati×φc heating, heat preservation,  ✘÷&cooling.

Touch screen operation: centralized dis÷αplay of upper and lower chamber tempe∞$€rature, time, running sta♣γ¶tus, support data export.

Safety design:

Chamber door linkage power off pro≤¥tection, over temperature a★§Ω♠larm, leakage protection.

Ceramic fiber or rockwool insulation λλ✔reduces heat loss and the risk of ext ₹ernal burns.

3、Technical parameters

Parameter Typical values/γ‌₹Description

Total volume 100L-2000L ↔∏€≠(upper cavity ratio can be customiz↔"  ed)

Temperature range Upper chamber: 50℃≈↕↔∞ -300 ℃; Lower chamber: room ®×☆temperature -200 ℃

Temperature control accuracy ±1℃ (si✘ ngle cavity)

Power supply 380V/50Hz (three-ph≥÷↑ase)

Material outer box: cold r€$olled steel spray; I  >§nner chamber: SUS304 stainl€ε♠'ess steel

4、Application scenarios​γ

Electronic Manufactu‍Ωαring:

PCB board production: high tαΩ ↔emperature curing solde¥ ±r resistance ink in the upper  ✘₽₽chamber, low temperature dryi÷ε∞ng circuit board in the lower chamb​≥♥er.

Composite material proces<¶  sing:

Prepreg treatment: the uppe≥≤↔r chamber solidifies the resin β≈≠at high temperature, and the lowe<Ωr chamber gradually cools to preπ‌vent deformation.

Food processing:

Layered drying: the upper part is deh©∏↔↕ydrated at high temperature, and∞  the lower part is kept a↕×t low temperature to maintain ✘♥★✔nutrients (to meet food ​§→¥grade material standards).

Laboratory studies:

Stage experiment: the upper cham ✔♥>ber sintered material at high temperat€♠φure, the lower chamber real-time coolin₽•‍ g test performance.

5、Product advantages

1、advanced equipment techn σ₩ology, exquisite workmanshi>↓♣♥p

2、Long normal service life, high p≠Ω&₩ass rate, to the technical ≥"↓level of imported equipment, more cost♠✘-effective.

3、our company has nearly 20 year♠‍φ₹s of experience in technica×₹l and after-sales service tea'✔πm, from design and producti≤ ©♠on to after-sales service π♥to provide customers with professiona‍♦l solutions.

6、Upper and lower chamber ove•₩↔n vs. independent mu≠£≈≠lti-chamber oven

Contrast item upper and lower chδ∑↔​amber oven independent fo→αλΩur chamber oven

The structure design is layered up‌♥ and down, suitable for mu<•lti-cavity independent stage proc®✘ess, suitable for multi-task £​parallel processing

Temperature control flexibility Large×☆↓ temperature difference between upper‌₹ and lower cavities,‍'δα suitable for step heating♥✔ each chamber temperature i<₩÷ndependent, suitable for☆↑↕  diverse needs

Lower cost (relatively simple structu∏φ ₩re) higher (more standalone​' systems)

Application scenario Phased process (su‌✘ch as curing + cooling) multi-va₩∞riety, multi-parameter sync≠Ωhronous processing

7、Selection suggestionsαβ♠∏

Process requirements:

If you need to heat in φ∞≈☆stages (such as high temperatu↕★→€re before low temperature), choose t€¶he upper and lower chamber↕  oven.

For multi-task independent processin₩✔"♦g (such as simultaneous drying of diffe↕¥€rent materials), choose an inδ¶dependent multi-chamber oven.™$✘

Space limitation:

Upper and lower chamber ovens hav✔≥e a small footprint and are suitabΩφ£₩le for workshops or labor≈₹☆atories with limited space.

Budget control:

Upper and lower chamber oven≤≤&∑s typically cost less thaε$•αn stand-alone multi-£¥chamber units.

8、Maintenance and precautions

Daily maintenance:

Clean the chamber residue  §∑regularly and check the he'®∑₹ating tube and fan statu↓↔s.

Calibrate the upper and low↕↔er chamber temperature sensors ♠÷↕™to ensure temperature contr✘&ol accuracy.

Safe operation:

Avoid overloading or ex¥©β₹cessive stacking, which affects hot air↑ γ  circulation.

Do not open the chamber door frequentl¥≤♦♥y during high temperature o"☆↓peration.

Technical indicators

For more models of products, ♣β please contact us. We®"® will be happy to serve y↓♦¶ou!